40G QSFP+ SR4, 300m MPO 850nm JHAQC01

Short Description:

40G QSFP+ SR4, 300m MPO 850nm


Overview

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Features:                                              

◊ Compliant to the 40GbE XLPPI electrical specification per IEEE 802.3ba-2010

◊ Compliant to QSFP+ SFF-8436 Specification

◊ Aggregate bandwidth of > 40Gbps

◊ Operates at 10.3125 Gbps per electrical channel with 64b/66b encoded data

◊ QSFP MSA compliant

◊ Capable of over 100m transmission on OM3 Multimode Fiber (MMF)and 150m on OM4 MMF

◊ Single +3.3V power supply operating  

◊ Without digital diagnostic functions  

◊ Temperature range 0°C to 70°C  

◊ RoHS Compliant Part

◊ Utilizes a standard LC duplex fiber cable allowing reuse of existing cable infrastructure

Applications:

◊ 40 Gigabit Ethernet interconnects

◊ Datacom/Telecom switch & router connections

◊ Data aggregation and backplane applications

◊ Proprietary protocol and density applications

Description:

It is a Four-Channel,Pluggable, LC Duplex, Fiber-Optic QSFP+ Transceiver for 40 Gigabit Ethernet Applications. This transceiver is a high performance module for short-range duplex data communication and interconnect applications. It integrates four electrical data lanes in each direction into transmission over a single LC duplex fiber optic cable. Each electrical lane operates at 10.3125 Gbps and conforms to the 40GE XLPPI interface.

The transceiver internally multiplexes an XLPPI 4x10G interface into two 20Gb/s electrical channels, transmitting and receiving each optically over one simplex LC fiber using bi-directional optics. This results in an aggregate bandwidth of 40Gbps into a duplex LC cable. This allows reuse of the installed LC duplex cabling infrastructure for 40GbE application. Link distances up to 100 m using OM3 and 150m using OM4 optical fiber are supported. These modules are de- signed to operate over multimode fiber systems using a nominal wavelength of 850nm on one end and 900nm on the other end. The electrical interface uses a 38 contact QSFP+ type edge connector. The optical interface uses a conventional LC duplex connector.

43

Transceiver Block Diagram

• Absolute Maximum Ratings

Parameter

Symbol

Min.

Typical

Max.

Unit

Storage Temperature

TS

-40

 

+85

°C

Supply Voltage

VCCT, R

-0.5

 

4

V

Relative Humidity

RH

0

 

85

%

• Recommended Operating Environment:

Parameter

Symbol

Min.

Typical

Max.

Unit

Case operating Temperature

TC

0

 

+70

°C

Supply Voltage

VCCT, R

+3.13

3.3

+3.47

V

Supply Current

ICC

 

 

1000

mA

Power Dissipation

PD

 

 

3.5

W

• Electrical Characteristics (TOP = 0 to 70 °C, VCC = 3.13 to 3.47 Volts

Parameter

Symbol

Min

Typ

Max

Unit

Note

Data Rate per Channel

 

-

10.3125

11.2

Gbps

 

Power Consumption

 

-

2.5

3.5

W

 

Supply Current

Icc

 

0.75

1.0

A

 

Control I/O Voltage-High

VIH

2.0

 

Vcc

V

 

Control I/O Voltage-Low

VIL

0

 

0.7

V

 

Inter-Channel Skew

TSK

 

 

150

Ps

 

RESETL Duration

 

 

10

 

Us

 

RESETL De-assert time

 

 

 

100

ms

 

Power On Time

 

 

 

100

ms

 

Transmitter
Single Ended Output Voltage Tolerance

 

0.3

 

4

V

1

Common mode Voltage Tolerance

 

15

 

 

mV

 

Transmit Input Diff Voltage

VI

120

 

1200

mV

 

Transmit Input Diff Impedance

ZIN

80

100

120

 

 

Data Dependent Input Jitter

DDJ

 

 

0.1

UI

 

Data Input Total Jitter

TJ

 

 

0.28

UI

 

Receiver
Single Ended Output Voltage Tolerance

 

0.3

 

4

V

 

Rx Output Diff Voltage

Vo

 

600

800

mV

 

Rx Output Rise and Fall Voltage

Tr/Tf

 

 

35

ps

1

Total Jitter

TJ

 

 

0.7

UI

 

Deterministic Jitter

DJ

 

 

0.42

UI

 

Note:

  1. 2080%

• Optical Parameters(TOP = 0 to 70 °C, VCC = 3.0 to 3.6 Volts)

Parameter

Symbol

Min

Typ

Max

Unit

Ref.

Transmitter
Optical Wavelength CH1

λ

832

850

868

nm

 

Optical Wavelength CH2

λ

882

900

918

nm

 

RMS Spectral Width

Pm

 

0.5

0.65

nm

 

Average Optical Power per Channel

Pavg

-4

-2.5

+5.0

dBm

 

Laser Off Power Per Channel

Poff

 

 

-30

dBm

 

Optical Extinction Ratio

ER

3.5

 

 

dB

 

Relative Intensity Noise

Rin

 

 

-128

dB/HZ

1

Optical Return Loss Tolerance

 

 

 

12

dB

 

Receiver
Optical Center Wavelength CH1

λ

882

900

918

nm

 

Optical Center Wavelength CH2

λ

832

850

868

nm

 

Receiver Sensitivity per Channel

R

 

-11

 

dBm

 

Maximum Input Power

PMAX

+0.5

 

 

dBm

 

Receiver Reflectance

Rrx

 

 

-12

dB

 

LOS De-Assert

LOSD

 

 

-14

dBm

 

LOS Assert

LOSA

-30

 

 

dBm

 

LOS Hysteresis

LOSH

0.5

 

 

dB

 

 Note

  1. 12dB Reflection 

3

Page02 is User EEPROM and its format decided by user.

The detail description of low memory and page00.page03 upper memory please see SFF-8436 document.

• Timing for Soft Control and Status Functions

Parameter

Symbol

Max

Unit

Conditions

Initialization Time t_init 2000 ms Time from power on1, hot plug or rising edge of Reset until the module is fully functional2
Reset Init Assert Time t_reset_init 2 μs A Reset is generated by a low level longer than the minimum reset pulse time present on the ResetL pin.
Serial Bus Hardware Ready Time t_serial 2000 ms Time from power on1 until module responds to data transmission over the 2-wire serial bus
Monitor Data ReadyTime t_data 2000 ms Time from power on1 to data not ready, bit 0 of Byte 2, deasserted and IntL asserted
Reset Assert Time t_reset 2000 ms Time from rising edge on the ResetL pin until the module is fully functional2
LPMode Assert Time ton_LPMode 100 μs Time from assertion of LPMode (Vin:LPMode =Vih) until module power consumption enters lower Power Level
IntL Assert Time ton_IntL 200 ms Time from occurrence of condition triggering IntL until Vout:IntL = Vol
IntL Deassert Time toff_IntL 500 μs toff_IntL 500 μs Time from clear on read3 operation of associated flag until Vout:IntL = Voh. This includes deassert times for Rx LOS, Tx Fault and other flag bits.
Rx LOS Assert Time ton_los 100 ms Time from Rx LOS state to Rx LOS bit set and IntL asserted
Flag Assert Time ton_flag 200 ms Time from occurrence of condition triggering flag to associated flag bit set and IntL asserted
Mask Assert Time ton_mask 100 ms Time from mask bit set4 until associated IntL assertion is inhibited
Mask De-assert Time toff_mask 100 ms Time from mask bit cleared4 until associated IntlL operation resumes
ModSelL Assert Time ton_ModSelL 100 μs Time from assertion of ModSelL until module responds to data transmission over the 2-wire serial bus
ModSelL Deassert Time toff_ModSelL 100 μs Time from deassertion of ModSelL until the module does not respond to data transmission over the 2-wire serial bus
Power_over-ride orPower-set Assert Time ton_Pdown 100 ms Time from P_Down bit set 4 until module power consumption enters lower Power Level
Power_over-ride or Power-set De-assert Time toff_Pdown 300 ms Time from P_Down bit cleared4 until the module is fully functional3

Note

1. Power on is defined as the instant when supply voltages reach and remain at or above the minimum specified value.

2. Fully functional is defined as IntL asserted due to data not ready bit, bit 0 byte 2 de-asserted.

3. Measured from falling clock edge after stop bit of read transaction.

4. Measured from falling clock edge after stop bit of write transaction.

• Pin Assignment

32 

Diagram of Host Board Connector Block Pin Numbers and Name

• Pin Description

Pin

Logic

Symbol

Name/Description

Ref.

1

 

GND

Ground

1

2

CML-I

Tx2n

Transmitter Inverted Data Input

 

3

CML-I

Tx2p

Transmitter Non-Inverted Data output

 

4

 

GND

Ground

1

5

CML-I

Tx4n

Transmitter Inverted Data Output

 

6

CML-I

Tx4p

Transmitter Non-Inverted Data Output

 

7

 

GND

Ground

1

8

LVTTL-I

ModSelL

Module Select

 

9

LVTTL-I

ResetL

Module Reset

 

10

 

VccRx

+3.3V Power Supply Receiver

2

11

LVCMOS-I/O

SCL

2-Wire Serial Interface Clock

 

12

LVCMOS-I/O

SDA

2-Wire Serial Interface Data

 

13

 

GND

Ground

1

14

CML-O

Rx3p

Receiver Inverted Data Output

 

15

CML-O

Rx3n

Receiver Non-Inverted Data Output

 

16

 

GND

Ground

1

17

CML-O

Rx1p

Receiver Inverted Data Output

 

18

CML-O

Rx1n

Receiver Non-Inverted Data Output

 

19

 

GND

Ground

1

20

 

GND

Ground

1

21

CML-O

Rx2n

Receiver Inverted Data Output

 

22

CML-O

Rx2p

Receiver Non-Inverted Data Output

 

23

 

GND

Ground

1

24

CML-O

Rx4n

Receiver Inverted Data Output

 

25

CML-O

Rx4p

Receiver Non-Inverted Data Output

 

26

 

GND

Ground

1

27

LVTTL-O

ModPrsL

Module Present

 

28

LVTTL-O

IntL

Interrupt

 

29

 

VccTx

+3.3V Power Supply Transmitter

2

30

 

Vcc1

+3.3V Power Supply

2

31

LVTTL-I

LPMode

Low Power Mode

 

32

 

GND

Ground

1

33

CML-I

Tx3p

Transmitter Inverted Data Output

 

34

CML-I

Tx3n

Transmitter Non-Inverted Data Output

 

35

 

GND

Ground

1

36

CML-I

Tx1p

Transmitter Inverted Data Output

 

37

CML-I

Tx1n

Transmitter Non-Inverted Data Output

 

38

 

GND

Ground

1

 Notes:

  1. GND is the symbol for single and supply(power) common for QSFP modules, All are common within the QSFP module and all module voltages are referenced to this potential otherwise noted. Connect these directly to the host board signal common ground plane. Laser output disabled on TDIS >2.0V or open, enabled on TDIS <0.8V.
  2. VccRx, Vcc1 and VccTx are the receiver and transmitter power suppliers and shall be applied concurrently. Recommended host board power supply filtering is shown below. VccRx, Vcc1 and VccTx may be internally connected within the QSFP transceiver module in any combination. The connector pins are each rated for maximum current of 500mA.

•  Recommended Circuit

43

 Mechanical Dimensions

56 


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